Comparison of gate leakage current components in metal-insulator-semiconductor structures with high-k gate dielectrics

Authors

  • Tomasz Janik Warsaw University of Technology image/svg+xml
  • Andrzej Jakubowski Warsaw University of Technology image/svg+xml
  • Bogdan Majkusiak Warsaw University of Technology image/svg+xml
  • Michał Korwin-Pawłowski X-ion S.A., France

DOI:

https://doi.org/10.26636/jtit.2001.1.38

Keywords:

MIS structures, ultrathin dielectrics, high-k dielectrics

Abstract

Numerical simulations of the gate leakage current in metal-insulator-semiconductor (MIS) structures based on the transfer matrix approach were carried out. They show contribution of different components of this current in MIS structures with best known high-k dielectrics such as Ta2O5 and TiO2. The comparison of the gate leakage current in MIS structures with SiO2 layer as well Ta2O5 and TiO2 layers is presented as well. Additionally, the minimum Si electron affinity to a gate dielectric which allows to preserve given level of the gate leakage current is proposed.

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References

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[3] B. Majkusiak and A. Jakubowski, "On electron tunneling in the metal-insulator-semiconductor systems including various electron effective masses", J. Appl. Phys., vol. 58, pp. 3141–3144, 1985.
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Submitted

2023-04-06

Published

2001-03-30

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How to Cite

[1]
T. Janik, A. Jakubowski, B. Majkusiak, and M. Korwin-Pawłowski, “Comparison of gate leakage current components in metal-insulator-semiconductor structures with high-k gate dielectrics”, JTIT, vol. 3, no. 1, pp. 65–69, Mar. 2001, doi: 10.26636/jtit.2001.1.38.

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