Trends in assembling of advanced IC packages

Authors

  • Ryszard Kisiel
  • Zbigniew Szczepański

DOI:

https://doi.org/10.26636/jtit.2005.1.291

Keywords:

IC packages, SiP, wire bonding, TAB, flip chip

Abstract

In the paper, an overview of the current trends in the development of advanced IC packages will be presented. It will be shown how switching from peripheral packages (DIP, QFP) to array packages (BGA, CSP) and multichip packages (SiP, MCM) affects the assembly processes of IC and performance of electronic systems. The progress in bonding technologies for semiconductor packages will be presented too. The idea of wire bonding, flip chip and TAB assembly will be shown together with the boundaries imposed by materials and technology. The construction of SiP packages will be explained in more detail. The paper addresses also the latest solutions in MCM packages.

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Published

2005-03-30

Issue

No. 1 (2005)

Section

ARTICLES FROM THIS ISSUE

License

Copyright (c) 2005 Journal of Telecommunications and Information Technology

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.

How to Cite

[1]
R. Kisiel and Z. Szczepański, “Trends in assembling of advanced IC packages”, JTIT, vol. 19, no. 1, pp. 63–69, Mar. 2005, doi: 10.26636/jtit.2005.1.291.