KISIEL, Ryszard; SZCZEPAŃSKI, Zbigniew. Trends in assembling of advanced IC packages. Journal of Telecommunications and Information Technology, [S. l.], v. 19, n. 1, p. 63–69, 2005. DOI: 10.26636/jtit.2005.1.291. Disponível em: https://jtit.pl/jtit/article/view/291. Acesso em: 12 dec. 2024.